Infineon Mobile Phones & Portable Devices Driver

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Infineon's 2002+ platform brings camera functionality, polyphonic-ring tones, color displays and Java capability to mid-range mobile phones. Featuring all hardware and software components required for camera-capable phones, it has the potential to reduce the development time of mobile phones and their derivatives by 25 percent to 50 percent. Infineon said Nokia NOK, -3.43% would use the platform, called E-GOLD voice, in handsets designed mostly to make phone calls, and equipped with a few basic features such as color screen and text.

Intel Mobile Communications
TypeWholly owned subsidiary
FateSmartphone communications division Acquired by Apple
ProductsSemiconductor products and solutions for wireless communications
ParentIntel Corporation

Ivt others driver login. Intel Mobile Communications (IMC), is the mobile research and development division of Intel. It was formed when Intel completed the acquisition of the Wireless Solutions (WLS) division of Infineon early in 2011 for US$1.4 billion.[1] The Infineon subsidiary Comneon was also acquired by Intel and is now integrated into Intel Mobile Communications.[2][3]

IMC develops, manufactures and markets semiconductor products and solutions for wireless communications. It targets the fast-growing market segments of smart phones, connected devices (e.g. tablets, USB dongles, mobile PCs, M2M), and ultra-low-cost/entry phones. Its roadmap is focused on providing cost-effective 2G/3G single-chip platforms for ULC phones up to entry-level smart phones and 3G/4G slim modem and RF solutions for mid-to high-end smart phones and connected devices.

In 2013 due to re-organization, a new organization was formed, named WPRD (Wireless Products Research & Development), which included the former IMC teams, and also the former MWG (Intel legacy Mobile and Wireless Group). This organization was managed by Aicha Evans. In 2016 the name was changed to iCDG (Intel Communications Devices Group). In 2017 Aicha Evans moved and became the chief strategy officer of Intel.

On April 16, 2019, Apple and Qualcomm reached a settlement which included Apple paying an unspecified amount, entering into a six-year patent licensing agreement, and a multi-year agreement for Qualcomm to provide hardware to Apple.[4] Shortly after Intel announced they will exit the 5G smartphone modem business to focus 5G efforts on network infrastructure.[5]

On July 25, 2019, Apple and Intel announced an agreement for Apple to acquire Intel Mobile Communications' smartphone modem business for US$1 billion.[6] Intel will continue to develop modems for non-smartphones such as PCs, Internet of things and autonomous vehicles.

Infineon Mobile Phones & Portable Devices Drivers


Intel Mobile Communications develops 2G, 3G, 4G and 5GModems under the Intel XMM modems brand.[7]


Infineon Mobile Phones & Portable Devices Driver Download

Intel Mobile Communications developed the Intel Atom Z2000, Z2460, Z2580 system on a chip (SoC) processors.[8]

In 2017, external publications (not confirmed by Intel or Apple) indicated that AppleiPhone 7 & 8 LTE modems, in most of the units shipped, were based on Intel chips (developed in IMC or iCDG).[9][10]

Infineon Mobile Phones & Portable Devices Driver Updater


  1. ^AG, Infineon Technologies. 'Intel to Acquire Infineon's Wireless Solutions Business - Infineon Technologies'. Retrieved 2019-07-26.
  2. ^'Intel® Mobile Communications Mobile Software'. Intel. Retrieved 2013-10-02.
  3. ^'Unternehmensinformationen: Intel Mobile Communications' (in German). Intel. Archived from the original on 2013-10-04. Retrieved 2013-10-02.
  4. ^Kastrenakes, Jacob (2019-04-16). 'Apple and Qualcomm drop all lawsuits in surprise settlement'. The Verge. Retrieved 2019-05-11.
  5. ^'Intel to Exit 5G Smartphone Modem Business, Focus 5G Efforts on Network Infrastructure and Othermw-data:TemplateStyles:r999302996'>'Apple to acquire the majority of Intel's smartphone modem business'. Apple Newsroom. Retrieved 2019-07-26.
  6. ^'Intel Mobile Modem Solutions'. Intel. Retrieved 2019-05-11.
  7. ^Wong Chung Wee (2013-04-10). 'Intel Reiterates its Mobile Processor Offerings at Annual Developers Forum'. HardwareZone Singapore. Retrieved 2013-06-13.
  8. ^'Apple confirmed limiting iPhone 7 Qualcomm modem to keep performance on par with Intel chip'. appleinsider. Retrieved 2016-11-18.
  9. ^'2018 iPhones might use Intel modems exclusively, pushing Qualcomm aside'. TheVerge. Retrieved 2018-02-05.

External links[edit]

Infineon Mobile Phones & Portable Devices Driver Windows 7

Retrieved from ''
Infineon Speeds Up Design Cycles of Next-Generation UMTS Mobile Phones by Up to 30 Percent
Munich, Germany / Hong Kong – November 15, 2005 – Infineon Technologies AG (FSE/NYSE: IFX) today, at the 3G World Congress & Exhibition 2005 in Hong Kong, announced the availability of its latest multimedia mobile phone reference design platform. Infineon’s MP-EU platform enables mobile phone manufacturers to speed up introduction of next-generation UMTS phones by up to 30 percent from today’s 14 months on average. The MP-EU is the industry’s most integrated platform supporting UMTS, EDGE and GSM/GPRS cellular standards. Its intelligent scalability concept allows mobile phone manufacturers to smoothly evolve from 2G/2.5G phones to 2.75G and 3G phones as well as to easily adapt to design trends, since basic hardware and software components within the platform remain unchanged.
Using Infineon’s scalable platform MP-EU enables mobile phone manufacturers to quickly introduce a variety of UMTS models all based on the same core architecture, such as voice and data centric UMTS phones for business users and entertainment-centric UMTS phones for juvenile users. Furthermore, mobile phone manufacturers using Infineon’s GSM/GPRS platform benefit from easy migration to EDGE/UMTS dual mode phones and improved time to market by reuse of applications. Subject to complexity as well as additional functionalities to be implemented, the development cycle is likely to be reduced by up to 30 percent. UMTS phones incorporating Infineon’s MP-EU platform provide extensive mobile phone multimedia functionality, such as video streaming and video telephony compliant with the requirements in Europe, Asia, Japan and North America.
The MP-EU platform offers the industry’s highest-integration. At present, an UMTS phone needs around 300 to 450 electronic components. With Infineon’s highly integrated UMTS platform the number is reduced to below 200. MP-EU includes Infineon’s powerful S-GOLD2 baseband processor which obsoletes the necessity for an additional companion chip to deal with the highly complex processing needs such as modem- video and audio-data-processing on-chip The MP-EU platform supports all frequency bands for GSM/GPRS/EDGE and all six frequency bands specified for UMTS.
Market research company Strategy Analytics expects the number of UMTS mobile phones sold to grow from about 45 million in the year 2005 to approximately 412 million in 2010, amounting for an annual growth rate of about 55 percent over the next five years.
“Infineon ranks among the leading suppliers of semiconductor solutions for mobile phones with a strong track record in GSM and EDGE solutions,” said Clemens Jargon, Vice President and General Manager of the Feature Phone business unit at Infineon Technologies AG. “It is our goal to enable world-class 3G mobile phones and to provide mobile phone manufacturers with reference designs optimized for performance, power consumption, size, as well as ease-of-development. We expect to see UMTS handsets incorporating our MP-EU platform in the market in mid-2006.”
Technical information on MP-EU reference design platform
The MP-EU platform provides a broad variety of connectivity technologies, such as Bluetooth, Assisted GPS and WLAN. Next to the powerful S-GOLD2 baseband processor, highly integrated ICs like a power management single-chip and radio frequency (RF) transceivers, the SMARTi PM for GPRS/EDGE and the SMARTi 3G for UMTS, comprise this most advanced UMTS platform. MP-EU enables easy migration from mobile phones based on Infineon’s EDGE platform to UMTS phones.
The S-GOLD2 includes all hardware accelerators to enable next-generation UMTS applications, such as video streaming and video telephony, 3D gaming, data download, etc.
The SMARTi 3G is world’s first CMOS single-chip RF transceiver supporting all six frequency bands for UMTS defined for Europe, Asia, North America and Japan.
MP-EU is available now. An extensive dual mode modem test program demonstrates that the platform fulfils the standard 3GPP requirements. The test program includes testing of the protocol stack according to the GSM Certification Forum (GCF) requirements, infrastructure interoperability testing (IOT) with all major mobile network vendors and a worldwide field test program in 54 live networks.
Infineon will be present at 3G World Congress & Exhibition 2005 (16 - 18 November 2005, Hong Kong) at booth 1831 in hall 1 at the Hong Kong Convention and Exhibition Centre.
Additional information on Infineon’s MP-EU platform is available at , an overview about Infineon’s mobile solutions at
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for automotive, industrial and multimarket sectors, for applications in communication, as well as memory products. With a global presence, Infineon operates through its subsidiaries in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2004 (ending September), the company achieved sales of Euro 7.19 billion with about 35,600 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at